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High Speed SEM   ㅣ   HEM6000


High-speed scanning electron microscope for cross-scale imaging of large-volume specimens 


CIQTEK HEM6000 facilities technologies such as the high-brightness large-beam current electron gun, high-speed electron beam deflection system, high-voltage sample stage deceleration, dynamic optical axis, and immersion electromagnetic & electrostatic combo objective lens to achieve high-speed image acquisition whilst ensuring nano-scale resolution.


The automated operation process is designed for applications such as a more efficient and smarter large-area high-resolution imaging workflow. The imaging speed can reach more than 5 times faster than a conventional field emission scanning electron microscope (fesem).

High Speed SEM Image Gallery

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Technical Highlights


High-speed Automation 

  • Fully automatic sample loading & offloading process and image acquisition operation, which makes the overall imaging speed 5 times faster than that of conventional FESEM


Large Field of View 

  • Technology that dynamically shifts the optical axis according to the scanning deflection range, achieves minimum edge distortion


Low Imaging Distortion 

  • Specimen stage tandem deceleration technology, achieves low landing energy, whilst obtaining high-resolution images
CIQTEK FIB-SEM DB500 Specifications
Electro-Optical Systems 

Resolution 

1.3 nm @ 3 kV, SE; 2.2 nm @ 1 kV, SE

1.9 nm @ 3 kV, BSE; 3.3 nm @ 1 kV, BSE
Magnification
66 - 1,000,000x
Acceleration Voltage
0.1 kV - 6 kV (Deceleration mode)  
6 kV - 30 kV (None-decel mode)
Type of Objective Lens
Immersion electromagnetic & electrostatic combo objective lens
Electron Gun
High brightness Schottky field emission electron gun 
Sample Loading System Vacuum System
Fully automatic oil-free vacuum system
Specimen Monitoring
Horizontal main chamber monitoring camera; vertical sample exchange load-lock chamber monitoring camera 
Maximum Sample Size
4 inches in diameter 
Specimen stage
Type
Motorized 3-axis specimen stage (*optional piezoelectric driven specimen stage)
Travel Range X, Y: 110 mm; Z: 28 mm
RepeatabilityX: ±0.6 μm; Y: ±0.3 μm
Specimen Exchange
Full automatic
Sample Exchanging Duration＜15 min
Load-lock Chamber Cleaning
Fully automatic plasma cleaning system
Image Acquisition and Processing Dwell Time
10 ns/pixel
Acquisition Speed

2*100 M pixel/s 

Image Size
8K*8K
Detector & Accessories
Standard Configuration 

In-lens electron detector 

Optional Configuration

Low-angle backscattered electron detector

In-column high-angle backscattered electron detector
Piezoelectric-driven specimen stage
High-resolution large FOV mode (SW)
Loadlock chamber plasma cleaning system
6-inch specimen loading system
Active anti-vibration platform
AI noise reduction; large area field stitching; 3D reconstruction
User Interface Languages
English
Operating System
Windows
Navigation
Optical navigation, gesture quick navigation
Automatic Functions
Auto sample recognition, auto imaging area selection, auto brightness & contrast, auto focus, auto stigmator